Biosensors, Vol. 10, Pages 177: Microfluidic Packaging Integration with Electronic-Photonic Biosensors Using 3D Printed Transfer Molding

Alexandros G.Sfakianakis shared this article with you from Inoreader Biosensors, Vol. 10, Pages 177: Microfluidic Packaging Integration with Electronic-Photonic Biosensors Using 3D Printed Transfer Molding Μέσω Biosensors Biosensors, Vol. 10, Pages 177: Microfluidic Packaging Integration with Electronic-Photonic Biosensors Using 3D Printed Transfer Molding Biosensors doi: 10.3390/bios10110177 Authors: Christos Adamopoulos Asmaysinh Gharia Ali Niknejad Vladimir Stojanović Mekhail Anwar Multiplexed sensing in integrated silicon electronic-photonic platforms requires microfluidics with both high density micro-scale channels and meso-scale features to accommodate for optical, electrical, and fluidic coupling in small, millimeter-scale areas. Three-dimensional (3D) printed transfer molding offers a facile and rapid method to create both micro and meso-scale features in complex multilayer microfluidics in order to integrate with monolithic electronic-photonic system-on-chips with multiplexed rows of 5 μm radius micro-ring resonators (MRRs), allowing for simultaneous optical, electrical, and microfluidic coupling on chip. Here, we demonstrate this microfluidic packaging strategy on an integrated silicon photonic biosensor, setting the basis for highly multiplexed molecular sensing on-chip. View on the web Inoreader. Take back control of your news feed. Follow us on Twitter and Facebook.